Friday, October 18, 2013

Cognitive Systems Era - IBM


IBM Research is working on "interlayer cooling," in which <a href='/topic.cfm?id=water' >water</a> is pumped through tiny tubes penetrating chips are piggypacked using high-speed communication technology called through-silicon vias. IBM's approach is designed to deal with overheating problems that otherwise severely limit chip stacking. The protruding pipe fittings are for connecting water-cooling tubes.

IBM Research is working on "interlayer cooling," in which water is pumped through tiny tubes penetrating chips are piggypacked using high-speed communication technology called through-silicon vias. IBM's approach is designed to deal with overheating problems that otherwise severely limit chip stacking. The protruding pipe fittings are for connecting water-cooling tubes.

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